brittle, or extremely thin-walled workpieces. For such tasks, DRAMET developed the DS150-NC diamond wire saw.
Operating principle
The DS150-NC works with an endless wire coated with diamond grains. This wire moves at high speed and with almost no cutting pressure through the material. The result: clean, precise cuts with minimal material loss.
Technical highlights
• NC control for reproducible cutting movements
• Kerf widths in the tenth-of-a-millimeter range
• Minimal cutting pressure for gentle material processing
• Precise machining even of delicate or brittle workpieces
• Suitable for fine geometries and complex contours
Typical applications
• Semiconductor materials such as silicon, sapphire, or quartz
• High-performance ceramics
• Precision components in research and development
Conclusion
The DS150-NC diamond wire saw combines maximum precision with gentle material processing – ideal for sensitive materials and the most demanding applications.
📌 Contact us for more information or a demonstration of the DS150-NC.
