The semiconductor industry works with materials that are both extremely valuable and highly sensitive. Silicon, quartz, sapphire, or gallium arsenide are used in wafers, substrates, and specialized components. Their processing requires the utmost precision to avoid compromising the functionality of the parts.
Challenges in Semiconductor Materials
Sensitivity to mechanical stresses
Risk of microcracks or thermally induced stresses
High quality requirements for surfaces
High material costs – every millimeter counts
The DRAMET Solution
Our fine-grit, diamond-coated saw bands deliver smooth, chip-free edges at minimal cutting pressure. Kerfs of only 0.16–0.35 mm significantly reduce material loss. NC control and process monitoring ensure reproducible results – ideal for series production.
Suitable Machines
200 Series – for small, delicate workpieces in laboratories and prototype production
270 Series – flexible and automatable for medium-scale series
400 Series – powerful for larger wafer carriers or quartz plates
Conclusion
With DRAMET diamond band saws, you achieve maximum precision, minimal material loss, and reproducible quality in semiconductor processing.
Contact us for a non-binding consultation on your application.
